首页> 外国专利> Self-Aligned Patterning Process Utilizing Self-Aligned Blocking and Spacer Self-Healing

Self-Aligned Patterning Process Utilizing Self-Aligned Blocking and Spacer Self-Healing

机译:利用自对准阻挡和垫片自愈的自对准图案化工艺

摘要

A multiple patterning process is provided with a self-aligned blocking (SAB) technique. The SAB technique trades off difficult overlay requirements for more manageable etch selectivity requirements between the various layers utilized for the patterning process. As disclosed herein, damage to sidewalls resulting from etching at the self-aligned block masking step may still occur. Damage is repaired by providing a plug layer that fills the areas of the damaged spacers. The plug layer may be the same material as forms the spacers. In this manner, the fill process provides a self-healing mechanism for damaged spacers.
机译:通过自对准块(SAB)技术提供了多种构图工艺。 SAB技术在困难的覆盖要求之间进行权衡,以便在用于构图工艺的各个层之间获得更可控的蚀刻选择性要求。如本文所公开的,由于在自对准块掩模步骤中的蚀刻而导致的侧壁损坏仍然可能发生。通过提供一个填充损坏的垫片区域的塞子层可以修复损坏。插塞层可以是与形成间隔物的材料相同的材料。以这种方式,填充过程为损坏的垫片提供了一种自修复机制。

著录项

  • 公开/公告号US2018061658A1

    专利类型

  • 公开/公告日2018-03-01

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US201715661825

  • 发明设计人 NIHAR MOHANTY;

    申请日2017-07-27

  • 分类号H01L21/311;H01L21/02;H01L21/768;H01L21/3105;H01L21/027;H01L21/033;

  • 国家 US

  • 入库时间 2022-08-21 13:00:31

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