Methods of Forming Sources and Drains for FinFETs Using Solid Phase Epitaxy With Laser Annealing

摘要

Methods disclosed herein include replacing top portions of source and drain sections of a finFET structure having sidewalls and a first doping with doped amorphous silicon (a-Si) or amorphous silicon germanium (a-SiGe) having a second doping opposite to a first doping and that extends above the sidewalls. Disclosed method also include performing sub-melt laser annealing of the a-Si or a-SiGe to respectively form c-Si or c-SiGe to define the source and drain regions of the finFET. Unconverted a-Si or a-SiGe is removed. The source and drain regions so formed include expanded-area portions that extend beyond the tops of the sidewalls.