首页> 外国专利> MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) AND METHOD FOR FORMING SUCH MMIC HAVING RAPID THERMAL ANNEALING COMPENSATION ELEMENTS

MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) AND METHOD FOR FORMING SUCH MMIC HAVING RAPID THERMAL ANNEALING COMPENSATION ELEMENTS

机译:具有快速热退火补偿元件的单分子微波集成电路(MMIC)和形成这种MMIC的方法

摘要

A method and structure, the structure having a substrate, an active device in an active device semiconductor region; of the substrate, a microwave transmission line, on the substrate, electrically connected to the active device, and microwave energy absorbing "dummy" fill elements on the substrate. The method includes providing a structure having a substrate, an active device region on a surface of the structure, an ohmic contact material on the active device region, and a plurality of "dummy" fill elements on the surface to provide uniform heating of the substrate during a rapid thermal anneal process, the ohmic contact material and the "dummy" fill elements having the same radiant energy reflectivity. The rapid thermal anneal processing forms an ohmic contact between an ohmic contact material and the active device region and simultaneously converts the "dummy" fill elements into microwave lossy "dummy" fill elements.
机译:一种方法和结构,该结构具有衬底,在有源器件半导体区域中的有源器件;在衬底的另一端,在衬底上的微波传输线电连接到有源器件,并且在衬底上吸收微波能量的“虚拟”填充元件。该方法包括提供一种结构,该结构具有衬底,在该结构的表面上的有源器件区域,在有源器件区域上的欧姆接触材料以及在该表面上的多个“虚拟”填充元件,以提供对衬底的均匀加热。在快速热退火过程中,欧姆接触材料和“虚拟”填充元素具有相同的辐射能反射率。快速的热退火处理在欧姆接触材料和有源器件区域之间形成了欧姆接触,并且同时将“虚拟”填充元件转换为微波损耗的“虚拟”填充元件。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号