A high-efficiency and environmentally friendly alkaline copper chloride etchant for a printed circuit board, comprising copper chloride and a sub-etchant. The specific gravity of the etchant is controlled by an automatic detection feeding control machine, so that the concentration of the copper ions in the etchant reaches a set value. The sub-etchant comprises the following in percentage by weight: 10 to 30 percent of ammonium chloride, 0.0002 to 25 percent of carboxylic acid and/or ammonium carboxylate, 0.01 to 45 percent of ammonium carbonate and/or ammonium bicarbonate, 0.0001 to 20 percent of one or more selected from hydroxylamine hydrochloride, hydroxylamine sulphate and hydrazine hydrate, the balance being water. The initial feed amount B of copper chloride is calculated according to the following formula: B=(134.5/63.5)× the set value of the copper ion concentration A; the control parameter of the production process of the resulting etchant is set to be: the copper ion concentration of 30-170 g/L.
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机译：一种用于印刷电路板的高效且环保的碱性氯化铜蚀刻剂，其包含氯化铜和副蚀刻剂。蚀刻剂的比重由自动检测供给控制机控制，以使蚀刻剂中的铜离子浓度达到设定值。该次蚀刻剂包含以下重量百分比：10至30％的氯化铵，0.0002至25％的羧酸和/或羧酸铵，0.01至45％的碳酸铵和/或碳酸氢铵，0.0001至20％选自盐酸羟胺，硫酸羟胺和水合肼中的一种或多种，其余为水。根据下式计算氯化铜的初始进料量B：B ＝（134.5 / 63.5）×铜离子浓度A的设定值;和所得蚀刻剂的生产过程的控制参数为：铜离子浓度为30-170 g / L。
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