ENHANCED ADHESION BY NANOPARTICLE LAYER HAVING RANDOMLY CONFIGURED VOIDS

摘要

In described examples, a surface (201a) of a substrate (201) of a first material is modified by depositing a layer (500a) of a solvent paste comprising nanoparticles (402) of a second material that have a size that provides a melting point at a lower temperature than the melting point temperature of the bulk second material, and nanoparticles of a third material that have a size at least as large as the nanoparticle size of the second material and a melting point at a temperature higher than the melting point temperature of the second material. Nanoparticles of the second material have a higher weight percentage than nanoparticles of the third material. The nanoparticles (402) of the second material are sintered together at the melting point temperature of the second material. Voids (501) are created in the layer of second material by removing the nanoparticles of the third material. The voids (501) have random distribution and random three-dimensional configurations.