Enhanced adhesion by nanoparticle layers with randomly constructed voids

摘要

In the example described, the surface (201a) of the substrate (201) of the first material has nanoparticles (2) of a second material having a size that provides a melting point below the melting temperature of the bulk second material (2). 402) and nanoparticles of a third material having a size at least as large as the nanoparticle size of the second material and a melting point higher than the melting temperature of the second material. Modified by depositing layer (500a). The nanoparticles of the second material have a higher weight percentage than the nanoparticles of the third material. The nanoparticles (402) of the second material are sintered together at the melting temperature of the second material. By removing the third material, voids (501) are created in the layer of nanoparticles of the second material. The void (501) has a random distribution and a random three-dimensional configuration.