SOLDER PASTE CONTAINING LEAD-FREE SOLDER COMPOSITION WITH HIGH DUCTILITY AND SOLDERING SOLVENT

摘要

Disclosed is a solder paste comprising a lead-free solder composition and a soldering solvent. The lead-free solder composition comprises: 0.02-6 wt% of stibium; 0.03-3 wt% of copper; 0.03-8 wt% of bismuth; 30-60 wt% of indium; 0.3-8 wt% of silver; 5-11 wt% of magnesium; 0.1-2 wt% of scandium; 0.1-1.5 wt% of tantalum; and 10-45 wt% of tin. The soldering solvent comprises: 25-32 wt% of rosin; 5-7 wt% of a mixture of pentane diacid and 2-fluorobenzooic acid as an organic acid activator; 0.2-0.5 wt% of alkylphenol polyoxyethylene as a surfactant; 0.7-0.8 wt% of 1-octyl alcohol as a foaming agent; 0.5-0.7 wt% of hydroquinone as a stabilizer; and 20-32 wt% of a monoalkyl propylene glycol solvent.;COPYRIGHT KIPO 2018