The present invention provides a method for manufacturing a chemical mechanical planarization (CMP) polishing pad, the method comprising: a step of introducing, separately, to an internal chamber having a downstream open end, a liquid polyol component stream comprising an amine curative at a temperature T1 of 40-90C and a liquid isocyanate component stream at a temperature T2 of 40-90C, each under a set point pressure of 13,000-24,000 kPa through a side liquid feed port, such that the two streams are pointed towards each other and flow at 90 degrees to downstream flow, to form a reaction mixture by an impingement mixing the two components; a step of discharging a stream of the reaction mixture from the open end of the internal chamber under pressure through a narrow, preferably, round orifice and onto an open mold substrate having a urethane releasing surface; and a step of curing the reaction mixture to form a porous polyurethane reaction product.;COPYRIGHT KIPO 2018
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