LED Chip Scale PackageCSP and LED package having heat dissipation function

摘要

An LED chip scale package having a heat dissipation function and an LED package having a heat dissipation function are provided. The LED chip scale package having a heat dissipation function according to an embodiment of the present invention includes a light conversion layer for acquiring first light and emitting second light to the outside; a light emitting element which is in contact with one surface of the light conversion layer and emits the first light; and a circuit layer which is in contact with one surface of the light emitting element and has a constant current circuit for supplying constant power to the light emitting element. The circuit layer includes a through hole which penetrates the circuit layer and has one side touching the light emitting element. A heat dissipation member is further formed in the through hole.