LED Chip Scale PackageCSP and LED package having heat dissipation function

摘要

An LED chip scale package with heat dissipation and an LED package with heat dissipation are provided. An LED chip scale package having a heat dissipation function according to an embodiment of the present invention, the light conversion layer for obtaining the first light and sending the second light to the outside; A light emitting element provided to be in contact with one surface of the light conversion layer and emitting the first light; And a circuit layer provided to be in contact with one surface of the light emitting device, the circuit layer having a constant current circuit for supplying a constant power to the light emitting device, wherein the circuit layer penetrates the inside to be in contact with the light emitting device. It includes a through hole formed so as to further include a heat dissipation member in the through hole.