POLISHING PAD, APPARATUS FOR POLISHING SUBSTRATE HAVING SAME, AND MANUFACTURING METHOD OF POLISHING PAD

摘要

Disclosed are a polishing pad, an apparatus for polishing a substrate having the same, and a manufacturing method of the polishing pad. The polishing pad of the apparatus for polishing a substrate comprises: a main pad having a plurality of grooves formed on a polishing surface; a first connection unit connecting both ends of the main pad to each other; an inner pad bonded to the inside of the main pad; and a second connection unit connecting both ends of the inner pad to each other. The first connection unit and the second connection unit are formed at positions misaligned from each other along a circumferential direction. Therefore, the strength of the polishing pad may be improved.;COPYRIGHT KIPO 2018