POLYIMIDE ADHESIVE FILM-SHAPED ADHESIVE MATERIAL ADHESIVE LAYER ADHESIVE SHEET COPPER FOIL WITH RESIN COPPER CLAD LAMINATE PRINTED WIRING BOARD AND MULTI-LAYER BOARD AND MANUFACTURING METHOD THEREOF

摘要

An objective of the present invention is to provide a polyimide, an adhesive, a film-shaped adhesive material, an adhesive layer, an adhesive sheet, a copper foil with a resin, a copper clad laminate, a printed wiring board, a multi-layer wiring board, and a manufacturing method of the multi-layer wiring board. The polyimide is a reactant of a monomer group containing an aromatic tetracarboxylic acid anhydride including a symmetrical aromatic tetracarboxylic acid anhydride and diamine including aromatic diamine and dimer diamine. The adhesive includes the polyimide, a crosslinking agent, and an organic solvent. Therefore, the present invention can provide the adhesive with high moisture absorption and soldering heat resistance.