PCB PCB PCB module having multi-directional heat-radiation structure and radiation plate multi-layer PCB assembly and module case used in the same PCB module

摘要

According to an embodiment of the present invention, there is provided a PCB module having a multi-layer heat dissipation structure, comprising: an electrically insulating heat dissipation plate; and an upper printed circuit board (PCB) and a lower printed circuit board PCB assembly; An upper case covering an upper surface of the multilayer PCB assembly; And a lower case covering the lower surface of the multilayer PCB assembly, wherein the heat dissipation plate includes: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; And a second heat pole thermally contacting the inner surface of at least one of the upper and lower cases.;