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MCU and Motor Driver Leaf Modules of Coin-Sized PCBs in an Open-Innovation IoT/CPS Platform

机译:开放式IOT / CPS平台中硬币尺寸PCB的MCU和电机驱动器叶片模块

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One trillion IoT nodes will be in use in the 2030s. To realize the rapid penetration, development platforms, where IoT devices are easily prototyped, are required. We present the platform where IoT devices are realized selecting and connecting several single-function PCBs. Moreover, we have developed a 58-pin connection mechanism by rubber connectors and have realized a 32-bit high-performance MCU PCB module, which requires many pins for its multiple functions. We have also realized a motor driver PCB module, which mounts a wire connection mechanism where wire connection to motors is realized without soldering. These modules enable us to prototype our own IoT devices with wireless communication PCB modules and/or camera PCB modules. The proposed platform provides Jisso technology for everyone to prototype own IoT devices easily.
机译:20世纪30年代将使用一万亿的IOT节点。 为了实现快速的渗透,开发平台,即可轻松原型,可以逼测。 我们介绍了IOT设备的平台,其中实现了选择和连接多个单功能PCB。 此外,我们开发了由橡胶连接器开发了58针连接机构,并实现了32位高性能MCU PCB模块,这需要多个功能。 我们还实现了一种电机驱动器PCB模块,其安装有电线连接机构,其中与电动机的电线连接无焊接。 这些模块使我们能够使用无线通信PCB模块和/或摄像机PCB模块来原型。 该拟议的平台为每个人提供了jisso技术,可以轻松地原型。

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