The present invention relates to a reflow soldering apparatus for an SMT process, which has little restriction on an installation space and is capable of mounting (soldering) components of a circuit board by LEDs without using gas, and more particularly, to a reflow device for mounting (soldering) a circuit board provided with a plurality of components. The reflow soldering device comprises: a main body unit in which a circuit board is able to move; a heat source unit which is disposed in the main body unit to irradiate light by power applied thereto and heat the component to be mounted on the circuit board so as to mount the component on the circuit board (PCB); and a controller which controls the main body unit and the heat source unit, wherein the controller controls a heat generation temperature of the heat source unit through photographing information including the height and a position of the component provided on the circuit board. The controller includes: a side camera provided in the main body unit and photographing a front surface or a back surface of the circuit board inserted into the main body unit, and then transmitting the photographed image to a microcomputer; a planar camera provided in the main body unit and photographing a plane of the circuit board inserted into the main body unit, and then transmitting the photographed image to the microcomputer; and a heat source power unit applying different power values to the heat source unit through the photographed image transmitted to the microcomputer so as to generate heat with different heat generation temperatures.;COPYRIGHT KIPO 2018
展开▼
