Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices

摘要

A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the adhesive, placing the circuit board into an oven where the circuit board is continuously heated to a first temperature until the adhesive is sufficiently cured so that it withstands reflow of the solder paste then to a second temperature to melt the solder paste.