Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component

摘要

Circuit board (10) for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface (24) for a connecting pin (40) of a wired component. A prescribed amount of solder (28) is provided which has a higher melting temperature than the solder paste.