VEHICLE ROOF SOLAR CHIP INTEGRATED DEVICE, SOLAR CAR, AND CHIP PACKAGING METHOD

摘要

The present invention provides a roof-mounted solar module integration device, a solar power vehicle and a encapsulation method for modules. The integration device comprises: a substrate in which a through-hole is formed, wherein a front side of the substrate is provided with a first trench, and a reverse side of the substrate is provided with a second trench; a solar module fixed on the front side of the substrate; a plurality of conductive bands arranged in the first trench, wherein a first end of each of the conductive bands is connected with the solar module, and a second end is led out of the through-hole to the reverse side of the substrate; and a bypass diode and an anti-reversion diode which are arranged in the second trench and connected with the second ends of the conductive bands. According to the roof-mounted solar module integration device, the solar power vehicle and the encapsulation method for modules as provided by the present invention, the trenches and the through-hole are formed in the substrate to achieve the arrangement of the bypass diode, the anti-reversion diode and the conductive bands, which solves the problem in the prior art that electrical wiring control is not accurate, thereby increasing the amount of incident light of the solar module, simplifying the process, and improving the accuracy of electrical arrangement.