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VEHICLE ROOF SOLAR CHIP INTEGRATED DEVICE, SOLAR CAR, AND CHIP PACKAGING METHOD.

机译:车顶太阳能芯片集成设备,太阳能汽车和芯片包装方法。

摘要

A vehicle roof solar chip integrated device, a solar car, and a chip packaging method. The integrated device comprises: a substrate (1) provided with a through hole (11), the front side of the substrate being provided with a first groove, and the back side being provided with a second groove; a solar chip (2) fixed to the front side of the substrate (1); a plurality of conductive tapes (3) provided in the first groove, a first end of each conductive tape (3) being connected to the solar chip (2) and a second end being led out of the through hole (11) to the back side of the substrate (1); and a bypass diode (4) and an anti-reversion diode provided in the second groove and connected to the second ends of the conductive tapes (3). According to the provided vehicle roof solar chip integrated device, solar car and chip packaging method, the groove and the through hole in the substrate are formed in the substrate to dispose the bypass diode, the anti-reversion diode, and the conductive tapes, so that the problem in the prior art of imprecise electrical wiring control is resolved, the light transmissivity of the solar chip is improved, the process is simplified, and the electrical wiring precision is improved.
机译:车顶太阳能芯片集成装置,太阳能汽车和芯片封装方法。该集成装置包括:基板(1),该基板(1)具有通孔(11),该基板的前侧设置有第一凹槽,而后侧设置有第二凹槽。太阳能芯片(2)固定在基板(1)的正面。多个导电带(3)设置在第一凹槽中,每个导电带(3)的第一端连接至太阳能芯片(2),第二端从通孔(11)引出至背面基板(1)的侧面;旁路二极管(4)和抗逆二极管设置在第二凹槽中并连接到导电带(3)的第二端。根据所提供的车顶太阳能芯片集成装置,太阳能汽车和芯片的封装方法,在基板上形成基板上的凹槽和通孔,以设置旁路二极管,抗逆二极管和导电带,因此解决了现有技术中不精确的电气布线控制问题,提高了太阳能芯片的透光率,简化了工艺,提高了电气布线精度。

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