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Growth of multi-layer group III-nitride buffers on large-area silicon substrates and other substrates

机译:多层III族氮化物缓冲剂在大面积硅衬底和其他衬底上的生长

摘要

A kind of method includes being formed in the first epitaxial layer on a semiconductor substrate and etching the first epitaxial layer, to form the first epitaxial region of multiple separation. This method further includes forming the second epitaxial layer, is etching the first epitaxial layer. Each epitaxial layer includes at least one group III-nitride, and a buffer is collectively formed with epitaxial layer. This method further comprises forming device layer to use semiconductor device layer in buffer and manufacture. Second epitaxial layer may include the second epitaxial region substantially only in the first epitaxial region. Second epitaxial layer can also cover the first epitaxial region and substrate, the second epitaxial layer can with or be not etched. Device layer is used to form the second epitaxial layer during being formed in same operation.
机译:一种方法包括在半导体衬底上的第一外延层中形成并蚀刻第一外延层,以形成多重分离的第一外延区域。该方法还包括形成第二外延层,蚀刻第一外延层。每个外延层包括至少一个III族氮化物,并且缓冲剂与外延层共同形成。该方法还包括形成器件层以在缓冲和制造中使用半导体器件层。第二外延层可以基本上仅在第一外延区域中包括第二外延区域。第二外延层也可以覆盖第一外延区和衬底,第二外延层可以被蚀刻或不被蚀刻。器件层用于在相同操作中形成第二外延层。

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