首页> 外国专利> COMPOUND, COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS

COMPOUND, COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS

机译:化合物,用于形成有机膜的组合物,用于制造半导体设备的基质,用于形成有机膜的方法以及图案化过程

摘要

The present invention provides a compound including two or more partial structures shown by the following general formula (1-1) in the molecule,wherein each Ar independently represents an aromatic ring optionally having a substituent or an aromatic ring that contains at least one nitrogen atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with an organic group; B represents an anionic leaving group that is capable of forming a reactive cation due to effect of either or both of heat and acid. This provides a compound that is capable of curing under the film forming conditions in air or an inert gas without forming byproducts, and forming an organic under layer film that has good dry etching durability during substrate processing not only excellent characteristics of gap filling and planarizing a pattern formed on a substrate.
机译:本发明提供了一种分子中具有两个或更多个由以下通式(1-1)表示的部分结构的化合物, <图像文件=“ IMGA0001.GIF” he =“ 23” imgContent =“ chem” imgFormat =“ GIF” wi =“ 67” /> 其中每个Ar独立地表示任选地具有取代基的芳环或包含至少一个任选地具有取代基的氮原子的芳环,并且两个Ars任选地彼此键合以形成环结构;虚线表示与有机基团的键。 B表示阴离子离去基团,由于热和酸之一或两者的作用,其能够形成反应性阳离子。这提供了一种化合物,该化合物能够在空气或惰性气体中的成膜条件下固化而不会形成副产物,并且能够形成不仅具有优异的间隙填充和平坦化特性而且在基板处理期间具有良好的干法蚀刻耐久性的有机底层膜。在基板上形成的图案。

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