Outflow cell, vapor deposition system including the outflow cell, and related method

摘要

The effusion cell is a weir for containing the material to be vaporized or sublimated, a delivery tube configured to deliver the vaporized or sublimated material resulting from the weir to the chamber, and a feed tube extending from the weir The feed tube captures condensation arising from the vaporized or sublimated material and the feed tube is arranged and configured to send the condensation back to the crucible, and the material in the crucible is heated to And at least one heating element arranged and configured to cause the vaporized or sublimed material flow through the delivery tube and the delivery from the outflow cell. The effusion cell is configured such that the crucible can be filled with the material to be vaporized or sublimated without removing the effusion cell from the process vacuum chamber. The semiconductor substrate processing system can include such an effusion cell. [Selected figure] Figure 4