CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, ADHESIVE FILM, COVERLAY FILM, AND PRINTED WIRING BOARD

摘要

To provide a curable resin composition that has excellent flow characteristics before curing, and has excellent adhesiveness, heat resistance, and flex resistance after curing; and provide a cured product of the curable resin composition, and an adhesive, adhesive film, coverlay film, and printed wiring board comprising the curable resin composition.SOLUTION: A curable resin composition contains thermosetting resin, thermoplastic resin and imide oligomer, with the imide oligomer having a reactive functional group that can react with the thermosetting resin.SELECTED DRAWING: None