SEMICONDUCTOR IMPLEMENTATION STRUCTURE AND SEMICONDUCTOR IMPLEMENTATION METHOD, APPLICATION DEVICE

摘要

To provide a semiconductor implementation structure having a semiconductor element and a cover material bonded to each other with an adhesive capable of preventing the adhesive to flow out and/or creep up on the side face.SOLUTION: The semiconductor implementation structure comprises: a rectangular semiconductor element; a rectangular protective member; and an adhesive positioned between the semiconductor and the protective member. The adhesive has an intermediate part between the semiconductor and the protective member, and a side face part covering the side faces of the rectangular protective member. The side face part has a rectangular shape in side view.SELECTED DRAWING: Figure 4