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Sputtering apparatus, sputtering film deposition method, and manufacturing method of laminated film and electrode substrate film
Sputtering apparatus, sputtering film deposition method, and manufacturing method of laminated film and electrode substrate film
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机译:溅射装置,溅射膜沉积方法以及层压膜和电极基板膜的制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a sputtering apparatus and sputtering deposition method, etc., capable of applying a DC power supply having a recovery function during abnormal discharge and inspecting the film deposition state of a film during deposition.SOLUTION: Means for conveying a long-sized body 12, a cooling can roll 16, first sputtering cathodes 17, 18, second sputtering cathodes 19, 20 and gas discharge pipes 25-32 for supplying a reactive gas are included in a vacuum chamber 10. In the sputtering apparatus for supplying electric power from a DC power supply to each sputtering cathode to perform sputtering and having a recovery function during abnormal discharge, reflection type laser sensors 33, 34 for inspecting the film deposition state of the film deposited on the long-sized body are attached at downstream side positions of the first sputtering cathodes and/or the second sputtering cathodes in the vicinity of the outer peripheral surface of the cooling can roll.SELECTED DRAWING: Figure 5
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