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Sputtering apparatus, sputtering film deposition method, and manufacturing method of laminated film and electrode substrate film

机译:溅射装置,溅射膜沉积方法以及层压膜和电极基板膜的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a sputtering apparatus and sputtering deposition method, etc., capable of applying a DC power supply having a recovery function during abnormal discharge and inspecting the film deposition state of a film during deposition.SOLUTION: Means for conveying a long-sized body 12, a cooling can roll 16, first sputtering cathodes 17, 18, second sputtering cathodes 19, 20 and gas discharge pipes 25-32 for supplying a reactive gas are included in a vacuum chamber 10. In the sputtering apparatus for supplying electric power from a DC power supply to each sputtering cathode to perform sputtering and having a recovery function during abnormal discharge, reflection type laser sensors 33, 34 for inspecting the film deposition state of the film deposited on the long-sized body are attached at downstream side positions of the first sputtering cathodes and/or the second sputtering cathodes in the vicinity of the outer peripheral surface of the cooling can roll.SELECTED DRAWING: Figure 5
机译:解决的问题:提供一种溅射装置和溅射沉积方法等,其能够在异常放电期间施加具有恢复功能的直流电源,并在沉积期间检查膜的膜沉积状态。在真空室10中包括长形体12,冷却罐辊16,第一溅射阴极17、18,第二溅射阴极19、20和用于供应反应气体的气体排放管25-32。从直流电源向每个溅射阴极提供电力以执行溅射并且在异常放电期间具有恢复功能,用于检查沉积在长尺寸体上的膜的膜沉积状态的反射型激光传感器33、34安装在在冷却罐的外周表面附近,第一溅射阴极和/或第二溅射阴极的下游侧位置滚动。 RAWING:图5

著录项

  • 公开/公告号JP6566208B2

    专利类型

  • 公开/公告日2019-08-28

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20160010039

  • 发明设计人 大上 秀晴;

    申请日2016-01-21

  • 分类号C23C14/34;C23C14/08;H01B13;B32B15/08;G06F3/041;

  • 国家 JP

  • 入库时间 2022-08-21 12:19:38

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