Method of performing CMP process using slurry composition for CMP used for organic film polishing and method of manufacturing semiconductor device using the same

摘要

PROBLEM TO BE SOLVED: To provide a CMP slurry composition used for polishing an organic film and a method of manufacturing a semiconductor device using the same.SOLUTION: The CMP slurry composition may include oxide-polishing particles, an oxidant, and deionized water, and optionally further include at least one of a polishing regulator, a surfactant, and a pH regulator. The CMP slurry composition allows a silicon-free organic film to be polished with an excellent selection ratio higher than or equal to 6:1 with respect to an oxide film.