首页> 外国专利> Additive for resist underlayer film forming composition and resist underlayer film forming composition containing the additive

Additive for resist underlayer film forming composition and resist underlayer film forming composition containing the additive

机译:用于抗蚀剂下层膜形成组合物的添加剂和包含该添加剂的抗蚀剂下层膜形成组合物

摘要

wherein R1s are each independently a hydrogen atom or a methyl group, R2 is a C1-3 alkylene group, A is a protecting group, R3 is an organic group having 4 to 7-membered ring lactone skeleton, adamantane skeleton, tricyclodecane skeleton, or norbornane skeleton, and R4 is a linear, branched, or cyclic organic group having a carbon atom number of 1 to 12, wherein at least one hydrogen atom is substituted with a fluoro group and that optionally has at least one hydroxy group as a substituent. A resist underlayer film-forming composition for lithography including additive, a resin that is different from copolymer, organic acid, crosslinker, and solvent, wherein the copolymer's content is 3 parts by mass to 40 parts by mass relative to 100 parts by mass of the resin.
机译:其中R1各自独立地为氢原子或甲基,R2为C1-3亚烷基,A为保护基,R3为具有4至7元环内酯骨架,金刚烷骨架,三环癸烷骨架或降冰片烷骨架,R4为碳原子数为1至12的直链,支链或环状有机基团,其中至少一个氢原子被氟取代,并且任选地具有至少一个羟基作为取代基。用于光刻的抗蚀剂下层膜形成用组合物,其包含添加剂,不同于共聚物的树脂,有机酸,交联剂和溶剂,相对于100质量份的所述共聚物,共聚物的含量为3质量份至40质量份。树脂。

著录项

  • 公开/公告号JP6497535B2

    专利类型

  • 公开/公告日2019-04-10

    原文格式PDF

  • 申请/专利权人 日産化学株式会社;

    申请/专利号JP20170551831

  • 发明设计人 西田 登喜雄;坂本 力丸;

    申请日2016-11-08

  • 分类号G03F7/11;C08F220/10;G03F7/20;

  • 国家 JP

  • 入库时间 2022-08-21 12:18:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号