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Replacement body FinFET for improved junction profile with gate self-aligned junctions

机译:替代品FinFET可通过栅极自对准结改善结形

摘要

After forming an epitaxial semiconductor layer on portions of a semiconductor located on opposite sides of a sacrificial gate structure, dopants from the epitaxial semiconductor layer are diffused into the semiconductor fin to form a dopant-containing semiconductor fin. A sacrificial gate stack is removed to provide a gate cavity that exposes a portion of the dopant-containing semiconductor fin. The exposed portion of the dopant-containing semiconductor fin is removed to provide an opening underneath the gate cavity. A channel which is undoped or less doped than remaining portions of the dopant-containing semiconductor fin is epitaxially grown at least from the sidewalls of the remaining portions of the dopant-containing semiconductor fin. Abrupt junctions are thus formed between the channel region and the remaining portions of the dopant-containing semiconductor fin.
机译:在位于牺牲栅结构的相对侧上的半导体部分上形成外延半导体层之后,来自外延半导体层的掺杂剂扩散到半导体鳍中以形成含掺杂剂的半导体鳍。去除牺牲栅叠层以提供露出一部分含掺杂剂的半导体鳍的栅腔。去除包含掺杂剂的半导体鳍的暴露部分,以在栅极腔下方提供开口。至少从含掺杂剂的半导体鳍片的其余部分的侧壁外延地生长未掺杂或比含掺杂剂的半导体鳍片的其余部分更少掺杂的沟道。从而在沟道区和含掺杂剂的半导体鳍的其余部分之间形成突变结。

著录项

  • 公开/公告号US10374090B2

    专利类型

  • 公开/公告日2019-08-06

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201715675970

  • 发明设计人 VIOREL ONTALUS;

    申请日2017-08-14

  • 分类号H01L29/76;H01L29/78;H01L29/08;H01L29/66;H01L29/417;H01L21/84;H01L21/8238;H01L29/10;

  • 国家 US

  • 入库时间 2022-08-21 12:13:44

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