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Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages
Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages
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机译:集成式扇出封装,集成式扇出封装阵列以及制造集成式扇出封装的方法
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摘要
An integrated fan-out package including a die, an insulating encapsulation, a filler, and a redistribution circuit structure is provided. The insulating encapsulation encapsulates sidewalls of the die, and the insulating encapsulation includes a recess on a top surface thereof. The filler covers the top surface of the insulating encapsulation and is being at least partially filled in the recess. The redistribution circuit structure covers an active surface of the die and the filler while being electrically connected to the die. The redistribution structure includes a dielectric layer covering the die and the filler. In addition, a method of manufacturing integrated fan-out packages is also provided.
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