首页>
外国专利>
HEAT RADIATION DEVICE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
HEAT RADIATION DEVICE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
展开▼
机译:散热装置,包含相同组件的半导体封装以及包含相同组件的半导体器件
展开▼
页面导航
摘要
著录项
相似文献
摘要
A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.
展开▼