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Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same
Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same
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机译:散热装置,包括该散热装置的半导体封装以及包括该散热装置的半导体装置
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摘要
A heat radiation device includes a semiconductor substrate. A first electrode is disposed on the semiconductor substrate. A second electrode is disposed on the semiconductor substrate and is spaced apart from the first electrode. A first through electrode is disposed in the semiconductor substrate. The first through electrode is electrically connected to the first electrode.
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