首页> 外文会议> >A summary review of displacement damage from high energy radiation in semiconductors and semiconductor devices
【24h】

A summary review of displacement damage from high energy radiation in semiconductors and semiconductor devices

机译:半导体和半导体器件中高能辐射引起的位移损伤概述

获取原文

摘要

High energy radiation produces defect complexes in semiconductor materials which reduce minority carrier lifetime, change majority carrier density, and reduce mobility. Most of the experimental data on semiconductors and semiconductor devices has been taken using high energy neutrons. Recent research has shown that this data can be extrapolated to other high energy radiation such as protons, electrons, alpha particles and gamma rays by normalizing to the energy going into atomic processes. Minority carrier lifetime is the most sensitive electronic property of silicon in the neutron environment. The degradation of minority carrier lifetime results in changes in semiconductor device properties such as current gain, storage time, saturation voltage and sink current. Carrier removal is the next most important characteristic of displacement damage and it causes a decrease in carrier mobility and an increase in resistivity. The dependence of these basic semiconductor properties on neutron fluence is introduced into device models such as SPICE and the resulting radiation inclusive model permits quantitative determination of device parameters as a function of neutron fluence.
机译:高能辐射会在半导体材料中产生缺陷复合物,从而缩短少数载流子的寿命,改变多数载流子的密度并降低迁移率。关于半导体和半导体器件的大多数实验数据都是使用高能中子获得的。最近的研究表明,可以通过归一化进入原子过程的能量,将这些数据外推到其他高能辐射,例如质子,电子,α粒子和γ射线。少数载流子寿命是中子环境中硅最敏感的电子特性。少数载流子寿命的降低导致半导体器件特性的变化,例如电流增益,存储时间,饱和电压和吸收电流。去除载流子是位移损伤的下一个最重要的特征,它导致载流子迁移率下降和电阻率增加。这些基本半导体特性对中子注量的依赖性被引入到诸如SPICE之类的设备模型中,所得到的包含辐射的模型允许根据中子注量来定量确定设备参数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号