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Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
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机译:堆叠封装装置中的堆叠芯片封装,其组装方法以及包含该系统的系统
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摘要
A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer.
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