首页> 外国专利> PERFORMANCE AWARE WORD LINE UNDER-DRIVE READ ASSIST SCHEME FOR HIGH DENSITY SRAM TO ENABLE LOW VOLTAGE FUNCTIONALITY

PERFORMANCE AWARE WORD LINE UNDER-DRIVE READ ASSIST SCHEME FOR HIGH DENSITY SRAM TO ENABLE LOW VOLTAGE FUNCTIONALITY

机译:用于高密度SRAM的驱动器读取辅助方案下的性能字线启用低电压功能

摘要

PMOS-based temperature compensated read-assist circuits for low-Vmin 6T SRAM bitcells realized in nanometer scale (e.g., 7 nm) CMOS FinFET technologies generate maximum wordline lowering (lower wordline voltages) at higher temperatures and minimum wordline lowering (higher wordline voltages) at lower operating temperatures in way that is substantially process independent and avoids post-silicon tuning. A read-assist PMOS transistor is connected between an associated wordline and VSS and controlled by a temperature compensation signal produced at an intermediate node between weak pull-up and strong pull-down PMOS transistors that are connected in series between VDD and VSS and respectively controlled by VDD and VSS during read operations. This configuration generates the temperature compensation signal at a level closer to VSS at high temperatures than at low temperatures, whereby write-ability is not impacted by the read-assist circuit at low temperature. An optional actuation circuit disables the temperature compensation circuit during non-active cycles to prevent current leakage.
机译:用于纳米级(例如7 nm)的低Vmin 6T SRAM位单元的基于PMOS的温度补偿读取辅助电路,CMOS FinFET技术在较高温度下产生最大字线降低(较低字线电压),而最小字线降低(较高字线电压)在较低的工作温度下以基本上与工艺无关的方式避免硅后调整。读辅助PMOS晶体管连接在相关的字线和VSS之间,并由在弱上拉和强下拉PMOS晶体管之间的中间节点产生的温度补偿信号控制,该晶体管在VDD和VSS之间串联并分别受控制在读取操作期间由VDD和VSS供电。这种配置产生的温度补偿信号在高温下比在低温下更接近VSS,从而在低温下不会受到读辅助电路的影响。可选的启动电路会在非活动周期内禁用温度补偿电路,以防止电流泄漏。

著录项

  • 公开/公告号US2019221256A1

    专利类型

  • 公开/公告日2019-07-18

    原文格式PDF

  • 申请/专利权人 SYNOPSYS INC.;

    申请/专利号US201916241349

  • 发明设计人 VINAY KUMAR;RAVINDRA KUMAR SHRIVASTAVA;

    申请日2019-01-07

  • 分类号G11C11/419;G11C11/418;H01L27/11;

  • 国家 US

  • 入库时间 2022-08-21 12:10:57

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