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A Half-Select Disturb-Free 11T SRAM Cell With Built-In Write/Read-Assist Scheme for Ultralow-Voltage Operations

机译:具有内置写/读辅助方案的半选型无干扰11T SRAM单元,用于超低压操作

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This paper presents a half-select disturb-free 11T static random access memory (SRAM) cell for ultralow-voltage operations. The proposed SRAM cell is well suited for bit-interleaving architecture, which helps to improve the soft-error immunity with error correction coding. The read static noise margin (RSNM) and the write margin (WM) are significantly improved due to its built-in write/read-assist scheme. The experimental results in a 40-nm standard CMOS technology indicate that at a 0.5-V supply voltage, RSNM of the proposed SRAM cell is 19.8x and 0.96x as that of 6T and 8T SRAM cells with min-area, respectively. It achieves 11.84x and 9.56x higher WM correspondingly. As a result, a lower minimum operation voltage is obtained. In addition, its leakage power consumption is reduced by 53.3% and 44.5% when compared with 6T and 8T SRAM cell with min-area, respectively.
机译:本文提出了一种用于超低压操作的半选择无干扰11T静态随机存取存储器(SRAM)单元。所提出的SRAM单元非常适合于比特交织架构,其通过纠错编码有助于提高软错误抗扰性。由于其内置的写入/读取辅助方案,读取静态噪声容限(RSNM)和写入容限(WM)得到了显着改善。 40纳米标准CMOS技术的实验结果表明,在电源电压为0.5V的情况下,所建议的SRAM单元的RSNM分别是最小面积的6T和8T SRAM单元的RSNM的19.8x和0.96x。它相应地实现了11.84倍和9.56倍的更高WM。结果,获得了较低的最小工作电压。此外,与具有最小面积的6T和8T SRAM单元相比,其泄漏功耗分别降低了53.3%和44.5%。

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