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PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES
PROCESSES FOR FABRICATING LOW-FORCE WAFER TEST PROBES AND THEIR STRUCTURES
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机译:制造低压力晶片测试问题的过程及其结构
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摘要
Embodiments herein describe structures of low-force wafer test probes and formation thereof. Structures of low-force wafer test probes and their formation via gray scale etch or electroplating is described. Structures are described that include a lower base structure on top of a substrate and an upper blade structure on top of the lower base structure. In various embodiments, a crown of a C4 bump is accommodated by one or both of: i) a cavity present in the lower base structure; and ii) a height of the upper blade structure. Processes for fabricating probe structures are described that include forming lower base structures upon a substrate and forming upper blade structures on top of the lower base structures. The upper blade structures include at least one blade. Each of the blade(s) include a cutting edge that points toward a center point within the probe structure.
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