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MANUFACTURING METHOD OF VERTICAL GaN-BASED SEMICONDUCTOR DEVICE AND VERTICAL GaN-BASED SEMICONDUCTOR DEVICE

机译:垂直GaN基半导体器件的制造方法和垂直GaN基半导体器件的制造方法

摘要

A manufacturing method of a vertical GaN-based semiconductor device having: a GaN-based semiconductor substrate; a GaN-based semiconductor layer including a drift region having doping concentration of an n type impurity, which is lower than that of the GaN-based semiconductor substrate, and is provided on the GaN-based semiconductor substrate; and MIS structure having the GaN-based semiconductor layer, an insulating film contacting the GaN-based semiconductor layer, and a conductive portion contacting the insulating film, the method includes: implanting an n type dopant in a back surface of the GaN-based semiconductor substrate after forming of the MIS structure, and annealing the GaN-based semiconductor substrate after the implanting of the n type dopant.
机译:垂直GaN基半导体器件的制造方法,其具有:GaN基半导体衬底;和GaN基半导体层设置在GaN基半导体基板上,该GaN基半导体层包括具有比GaN基半导体基板的掺杂浓度低的n型杂质的掺杂浓度的漂移区。以及具有GaN基半导体层,与GaN基半导体层接触的绝缘膜以及与该绝缘膜接触的导电部分的MIS结构,该方法包括:在GaN基半导体的背面注入n型掺杂剂在形成MIS结构之后,再在注入n型掺杂剂之后对GaN基半导体衬底进行退火。

著录项

  • 公开/公告号US2019157448A1

    专利类型

  • 公开/公告日2019-05-23

    原文格式PDF

  • 申请/专利权人 FUJI ELECTRIC CO. LTD.;

    申请/专利号US201816177434

  • 申请日2018-11-01

  • 分类号H01L29/78;H01L29/20;H01L29/10;H01L29/66;H01L29/423;H01L29/08;H01L21/02;H01L21/223;H01L21/324;H01L29/04;

  • 国家 US

  • 入库时间 2022-08-21 12:08:19

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