SIGNAL TRACE FAN-OUT METHOD FOR DOUBLE-SIDED MOUNTING ON PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

摘要

The present invention provides a signal trace fan-out method for double-sided mounting on a PCB, including: respectively providing one or more blind vias on the top-layer surface and the bottom-layer surface of a PCB; and fanning out, through each of the blind vias, one or more signal traces of to-be-mounted components on the top-layer surface and the bottom-layer surface of the PCB. The number and positions of the blind vias are set based on the size of routing space when the to-be-mounted component is mounted on the top-layer surface or the bottom-layer surface of the PCB. In a manner of combining the blind vias with through holes, the present invention achieves successful fan-out of the signal traces when QSFP-DD connectors are mounted at same positions on both the top layer and the bottom layer of the PCB, and ensures relatively good signal integrality.