DOUBLE-SIDED MOUNTING MODULE, PRINTED CIRCUIT BOARD IN WHICH DOUBLE-SIDED MOUNTING MODULE IS MOUNTED, AND METHOD FOR MANUFACTURING DOUBLE-SIDED MOUNTING MODULE

摘要

An embodiment of the present invention relates to a double-sided mounting module, a printed circuit board in which the double-sided mounting module is mounted, and a method for manufacturing the double-sided mounting module. The double-sided mounting module comprises: a substrate in which an electrode for mounting is formed wherein a plurality of electronic devices are mounted on both sides of the substrate; a plurality of solder balls arranged on one surface of the substrate; and a plurality of electrode pads arranged to be close to an edge of the surface of the substrate where the plurality of solder balls are arranged wherein coupling force of the electrode pads is stronger than coupling force of the solder balls. Therefore, the double-sided mounting module can drastically enhance coupling force by small sacrifices of an area and a pin number.