MULTI-LAYERED PRINTED WIRING BOARD HAVING VIA HOLES CIRCUIT MODULE COMPRISING CIRCUIT ELEMENTS MOUNTED ON THE MULTI-LAYERED PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE MULTI-LAYERED PRINTED WIRING BOARD

摘要

The present invention provides a multilayer printed wiring board having a multi-layer substrate (18). The multi-layer substrate 18 has a plurality of conductive layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h), and their conductive layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h) between a plurality of insulating layers 21, and the plating layer of the through their insulating layer 21 and electrically connect the conductor layers (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h) arranged on the (24, 62 ) has a via hole (22, 61), the via-holes (22, 61) plating layer (23, 51a, 51b) passing through the with. Plating layer (23, 51a, 51b) are in the via-holes are exposed on the inner side (22, 61) and plating layers (24, 62) a plurality of conductive portions (25a, 25b, 52a, 52b, 52c, 63a, 63b) and division. Plating conductive regions ((25a, 25b, 52a, 52b, 52c, 63a, 63b) of the (24, 62) is electrically connected to the conductive layer (20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h) and.