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Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1. Design for the Environment Printed Wiring Board Project.

机译:印刷线路板清洁技术替代品评估:制作孔导电,第1卷。环境印刷线路板项目设计。

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摘要

The document is a technical document that presents comparative risk, competitiveness, and resource requirements information on seven technologies for performing the 'making holes conductive' (MHC) function during printed wiring board (PWB) manufacturing. MHC technologies are used by PWB manufacturers to deposit a seed layer or coating of conductive material into the drilled through-holes of rigid, multi-layer PWBs prior to electroplating. Volume I describes the MHC technologies, methods used to assess the technologies, and cleaner technologies substitutes assessment (CTSA) results. The technologies evaluated are electroless copper, carbon, conductive polymer, graphite, nonformaldehyde electroless copper, organic-palladium, and tin-palladium. Chemical and process information is also presented for a conductive ink technology, but this technology is not evaluated fully.

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