THROUGH-HOLE CONDUCTOR FORMING CONDUCTIVE PASTE AND ITS MANUFACTURING METHOD AS WELL AS BOTH-SIDE PRINTED WIRING BOARD USING THROUGH-HOLE CONDUCTOR FORMING CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide a through-hole conductor forming conductive paste superior in through- hole passing and soldering performance and its manufacturing method as well as a both-side printed wiring board using the through-hole conductor forming conductive paste. ;SOLUTION: A through-hole conductor forming conductive paste comprises containing sulfonic acid based hardening agent, binder, conductive powder formed of copper powder or copper alloy powder having almost all surfaces coated with silver while leaving exposed portions, and organic solvent; and a manufacture of the through-hole conductor forming conductive paste comprises coating almost all surfaces of copper powder or copper alloy powder with silver while leaving exposed portions and then uniformly mixing sulfonic acid hardening agent, binder and organic solvent added thereto; as well as a both-side printed wiring board comprises forming through-holes passing through a printed board having electric circuits on both sides, conducting the electric circuits on both sides through the through-holes with the above-described conductive paste or the conductive paste manufactured in the above- described method, and passing a portion of a through-hole conductor therethrough to form pin-insertion holes.;COPYRIGHT: (C)2001,JPO