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Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
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机译:使用具有实心芯导电材料的通孔在印刷线路板层之间进行电互连的方法
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摘要
The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.
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