Comparative effectiveness of infrared heat sources for mounting and dismounting electronic modules

摘要

Abstractefficiency of short- and medium-wave infrared (IR) heat sources used to mount and dismount electronic modules is assessed. The analysis of the models of thermal fields shows that for KGM 30/300 halogen IR lamps, the heating nonuniformity for a printed circuit board is 45–55°С, and for the casings of electronic components, the temperature varies from 90 to 100°С. For an Elstein SHTS/4 ceramic IR heater, the heating nonuniformity for a printed circuit board is 8–13°С, the temperature of SMD component casings differs from temperature of the the printed circuit board: in BGA by 28–32°С, in QFP by 24–26°С, and in SMD by 5–20°С. The application of medium-wave ceramic infrared sources makes it possible to attain a higher heating uniformity in the working area and ensure an optimal temperature profile when mounting and dismounting surface-mounted electronic components.