METHOD AND APPARATUS FOR ADAPTING/ADJUSTING SIGNAL PROPAGATION TIME IN PATH SYSTEM OR PATH NETWORK BETWEEN INTEGRATED CIRCUIT MOUNTED ON PRINTED BOARD AND MEMORY PACKAGE HAVING PRINTED BOARD AND AT LEAST ONE MEMORY MODULE MOUNTED ON THIS PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method and apparatus for realizing a delay time window smaller than 20ps after measuring a delay time on a mount or a package without capacitive fine adjustment in a printed board made of a conventional FR4 material, and a memory package manufactured by this method.;SOLUTION: This method comprises A) a step of providing a capacitive load structure in at least one of path systems or path networks near one or a plurality of housings in one of one or a plurality of integrated circuits in the printed board, B) a step of measuring all important delays or signal propagation time in the path networks or the path systems between the integrated circuit and C) a step of separating a predetermined capacitive load structure from at least one conductor path according to the measuring results of the step B) in order to minimize the maximum signal delay to be generated.;COPYRIGHT: (C)2001,JPO