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A Prediction Method of Common-Mode Excitation on a Printed Circuit Board Having a Signal Trace near the Ground Edge

机译:在接地边缘附近有信号走线的印刷电路板上共模激励的预测方法

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摘要

Common-mode excitation caused by an imperfect ground plane on a printed circuit board (PCB) has been conventionally explained with the 'current driven' scheme, in which the common-mode current is driven by the ground voltage across the unintentional inductance of the ground plane. We have developed an alternative method for estimating common-mode excitation that is driven by the difference of the common-mode voltages for two connected transmission lines. A parameter called current division factor (CDF) that represents the degree of imbalance of a transmission line explains the common-mode voltage. In this paper, we calculate the CDF with two-dimensional (2-D) static electric field analysis by using the boundary element method (BEM) for asymmetric transmission lines with an arbitrary cross-section. The proposed 2-D method requires less time than three-dimensional simulations. The EMI increase due to a signal line being close to the edge of the ground pattern was evaluated through CDF calculation. The estimated increase agreed well—within 2 dB—with the measured one.
机译:传统上已通过“电流驱动”方案解释了由印刷电路板(PCB)上的接地平面不完善引起的共模激励,其中共模电流由跨地的意外电感的接地电压驱动飞机。我们已经开发了一种估算共模激励的替代方法,该方法由两条连接的传输线的共模电压差驱动。代表传输线不平衡程度的称为电流分配因子(CDF)的参数解释了共模电压。在本文中,我们使用边界元方法(BEM)对具有任意横截面的非对称传输线进行了二维(2-D)静态电场分析,计算了CDF。所提出的二维方法比三维仿真所需的时间更少。通过CDF计算可以评估由于信号线靠近接地图案边缘而导致的EMI升高。估计的增加与测得的一致,在2 dB以内。

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