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Multilayer printed circuit board including first and second signal traces and a first ground trace

机译:包括第一和第二信号迹线以及第一接地迹线的多层印刷电路板

摘要

A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle the gap portion and so as to be substantially parallel to each other. The multilayer PCB also includes at least one ground trace provided between the at least two signal traces and on the top face of the substrate so as to straddle the gap portion.
机译:多层印刷电路板(PCB)包括基板;接地层具有限定间隙部分的边缘,该接地层设置在基板的底面上。至少两个信号迹线设置在基板的顶面上,以跨越间隙部分并且基本彼此平行。多层PCB还包括至少一条接地迹线,该至少一条接地迹线设置在至少两个信号迹线之间并且在基板的顶面上,以跨越间隙部分。

著录项

  • 公开/公告号US7061094B2

    专利类型

  • 公开/公告日2006-06-13

    原文格式PDF

  • 申请/专利权人 EIJI TAKAHASHI;TAKESHI NAKAYAMA;

    申请/专利号US20050035953

  • 发明设计人 TAKESHI NAKAYAMA;EIJI TAKAHASHI;

    申请日2005-01-18

  • 分类号H01L23/52;H01L23/12;H05K3/46;H01P5/02;

  • 国家 US

  • 入库时间 2022-08-21 21:43:50

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