A housing for receiving a circuit board with an overvoltage protection unit and overvoltage protection module. The housing includes a support frame and a film. The support frame is formed of a thermoplastic material and has a main leg, two side legs adjoining the main leg at one end in each case, and at least one lateral flat brace. The film is formed of a thermoplastic material and is formed U-shaped. An end face of the film at least partially covers an end face of the main leg, each side surface of the film at least partially covering the two side legs and the brace. The film is materially connected to the side legs such that the housing made up of the support frame and film is at least partially open on a side opposite the end face of the film.
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