TEMPERATURE-CONTROL UNIT FOR A FURNACE DEVICE FOR HEAT TREATING A PLATE

摘要

The present invention relates to a temperature-control unit for a furnace device (100) for the heat treatment of a printed circuit board (101), in particular a metal printed circuit board (101). The temperature-control unit has a temperature-control body which can be arranged in a furnace chamber (113) of the furnace device (100). The temperature-control body (103) has a plurality of receiving bores (104). The temperature-control unit also has a plurality of temperature-control pins (105), wherein the temperature-control pins (105) are mounted in the receiving bores (104) so as to be movable relative to the temperature-control body (103). The temperature-control pins (105) are controllable in such a way that a temperature-control group (106) of the temperature-control pins (105) can be extended from the temperature-control body (103) in the direction of the printed circuit board (101) so that thermal contact between the temperature-control group (106) and a predetermined temperature-control zone of the printed circuit board (101) can be generated at temperature-control pins (105).