ELECTROLYTIC COPPER FOIL, PRODUCTION METHOD THEREFOR, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, ELECTRONIC DEVICE, AND PRODUCTION METHOD THEREFOR

摘要

An electrolytic copper foil having a surface treatment layer on the glossy surface side thereof. In this electrolytic copper foil, the root mean square height Sq of the surface of the surface treatment layer is no more than 0.550 µm and the total amount of Zn included in the surface treatment layer, the total amount of Mo, or the total amount of Mo and Zn is at least 70 µg/dm². Alternatively, the surface roughness Sa of the surface of the surface treatment layer is no more than 0.470 µm and the total amount of Zn, the total amount of Mo, or the total amount of Mo and Zn included in the surface treatment layer is at least 70 µg/dm².